Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps BJ 820, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | BJ 820Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps BJ 820 |
| Specifications | ||
| Voltage | — | 230 V[1] |
| Configuration | — | 50-60 Hz[1] |
| Type | — | Wire bonder[1] |
| Model | — | BJ 820[1] |
| Electrical | — | 230 V, 50-60 Hz[1] |
| Bond head | — | 45-degree bond head[3] |
| Included items | — | Microscope, monitor, vacuum work holder[3] |
| Vintage | — | 2005[3] |
| Equipment type | — | Wire bonder[1] |
| Electrical rating | — | 230 V, 50-60 Hz[1] |
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