Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group EV 501 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | EV 501 WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Capable of thermo compression, fusion or anodic wafer bonding |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group EV 501 Wafer |
| Specifications | ||
| Configuration | — | Refurbished[1] |
| Wafer size | — | Capable of thermo compression, fusion or anodic wafer bonding[1] |
| Thickness | — | Max wafer stack thickness 6 mm[1] |
| Bottom side heater | — | 550°C max. in 1°C steps[1] |
| Temperature uniformity | — | ± 1,5 %[1] |
| Bonding capability | — | Capable of thermo compression, fusion or anodic wafer bonding[1] |
| Bond chamber | — | Bond chamber for small pieces up to 150 mm wafers (with correct tooling)[1] |
| Vacuum pump | — | Turbo Pump[1] |
| Power supply | — | High voltage power supply for anodic bonding (additional tooling may be required)[1] |
| Electronics | — | Electronics Rack[1] |
| Control/software | — | Computer & Software[1] |
| Display | — | LCD Monitor[1] |
| Pump | — | Roughing Pump[1] |
| Manual | — | Operations Manual[1] |
| Condition | — | Refurbished[1] |
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