Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 850 SOI Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 850 SOI WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 850 |
| Specifications | ||
| Configuration | — | Fully-Automatic[1] |
| Wafer size | — | Suitable for wafer sizes up to 6"/150mm wafers[1] |
| Manufacturer | — | EV Group[2] |
| Model | — | 850 SOI Wafer[1] |
| Category | — | Packaging & Bonding[2] |
| Operating mode | — | Fully-Automatic[1] |
| Maximum wafer size | — | up to 6"/150mm wafers[1] |
| Current configuration | — | configured for 6"/150mm wafers[1] |
| Robot | — | One Genmark Robot with pre-aligner[1] |
| Cleaning modules | — | Two Cleaning Modules[1] |
| Bonding station | — | One bonding station with high vacuum[1] |
| Pre-aligner | — | Mechanical pre-aligner on bond station (pneumatically actuated)[1] |
| Control interface | — | PC controlled with Windows-based graphical user interface[1] |
| Access control | — | Password protected access levels[1] |
| Cleaning control | — | Programmable rotational speed for substrate cleaning[1] |
| Cleaning option | — | Megasonic cleaning option[1] |
| Vintage | — | 2000[3] |
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