Waferpedia

Comparison ledger

0041-26723 Bonded AssemblyversusiHawk

Applied Materials 0041-26723 Bonded Assembly, ASM iHawk, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM iHawk
Specifications
Manufacturer—ASM[1]
Model—iHawk[1]
Equipment type—Wire Bonder[1]
Vintage—2012[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing