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Comparison ledger

0020 81665 PartversusRaider ECD 312 Electroplating

Applied Materials 0020 81665 Part, Semitool Raider ECD 312 Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 81665 PartApplied Materials
OEMApplied MaterialsSemitool
CategoryLab & Support EquipmentLab & Support Equipment
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 81665 PartSemitool Raider ECD
Specifications
ConfigurationGuide, Fiber Mount, Ude, Lk[1]50/60 Hz[2]
Phase—3 Phase[2]
Voltage—380 V[2]
Loadport—3 X FOUP[2]
PC—FUI[2]
Power Phase—3 Phase[2]
Frequency—50/60 Hz[2]
Wafer Handling Robot—Xfer Robot, 1x Linear Dual Arm with Edge Grip Endeffector[2]
Vacuum and Rinse—Vacuum prewet, 1 Stack SRD[2]
Chemical Tanks—11[2]
Chillers—4[2]
Controller—PC with FUI[2]
Chamber Components—Chamber lift assy, Spin motor, Push plate control board, Plate sylinder (2), Contact Ring (only ECD), Lip seal (only eCD), Flow pump (only eCD), Anode basket (only eCD)[2]
Tank Components—Tank body, Circulation pump, Filter housing, Heater housing, Level sensor (5), Tank remote board, Tank control block[2]
Vintage—2011[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing