Waferpedia

Comparison ledger

0020 23839 PartversusMVD4500

Applied Materials 0020 23839 Part, SPTS MVD4500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsSPTS
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartSPTS MVD4500
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]—
Tool type—Panel and large substrate tool[2]
Maximum substrate size—Up to 930 x 720 mm[2]
Processing mode—Batch processing[2]
Standard substrates—Gen 4.5 substrates; glass, polymer sheets, metals[2]
Precursors—Up to 4 precursors[2]
Capabilities—Integrated plasma surface treatment and chamber clean capability[2]
Type of product—Deposition Tool[3]
Substrate size—up to 930 x 720 mm[2]
Substrate handling—multiple substrates[2]
Process capability—ALD and MVD[2]
Tool class—panel and large substrate tool[2]
Throughput mode—batch processing[2]
Standard substrate format—Gen 4.5 substrates[2]
Standard substrate materials—glass, polymer sheets, metals[2]
Integrated capabilities—integrated plasma surface treatment and chamber clean capability[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]atomiclayerdeposition.comatomiclayerdeposition.com