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Comparison ledger

0020 18455 PartversusNGP 1000

Applied Materials 0020 18455 Part, Oxford Instruments NGP 1000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
NGP 1000Oxford Instruments
OEMApplied MaterialsOxford Instruments
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartOxford Instruments NGP 1000
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]Load Locked Chamber[2]
Category—Deposition[2]
Process—Plasma-enhanced chemical vapor deposition (PECVD)[3]
Wafer size capability—up to 450 mm[3]
Configured unit wafer size (2012 vintage)—8 inch[4]
RF power—600 W 13.56 MHz HF RF generator[2]
Process type—PECVD (Plasma-Enhanced Chemical Vapor Deposition)[4]
Wafer size—8 inch[4]
Vintage year—2012[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing