Waferpedia

Comparison ledger

0020 18455 PartversusSJ20C

Applied Materials 0020 18455 Part, Denton Vacuum SJ20C, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
SJ20CDenton Vacuum
OEMApplied MaterialsDenton Vacuum
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartDenton Vacuum SJ20C
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]—
Tool owner—Jim Pierce[2]
Serial number—18097[2]
Description—Film thickness monitor/deposition controller[2]
Deposition method—E-beam evaporation[2]
Source hearths—4 source hearth[2]
Evaporation materials available—Al, Ag, Au, Au/Ge, Cr, Cu, Ge, Mo, NiCr, Nb, Ni, Ta, Ti, W[2]
Crucible liner types—Poco Graphite crucible liners (large & small); Cu crucible liners[2]
Process—E-beam evaporation / physical vapor deposition[2]
Crucible pockets—4[3]
Crucible liner guidance—Do not fill crucible over 1/3 full[3]
Deposition controller settings—Density and Z-Ratio are programmed for the material to be deposited[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu