Waferpedia

Comparison ledger

0020 12458 PartversusAxcela

Applied Materials 0020 12458 Part, Applied Materials Axcela, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 12458 PartApplied Materials
AxcelaApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 12458 PartApplied Materials Axcela
Specifications
ConfigurationInsulator,Side Match,Hdp-Cvd Ultima Plus[1]7 System[2]
Asset number146526[1]—
MakeApplied Materials[1]—
Model0020 12458[1]Axcela[2]
Tables—5 x 300 mm (no backside)[2]
Wafer size capability—150mm, 200mm, 300mm[3]
Film thickness uniformity—< 2%[3]
Maximum film thickness—8 µm[3]
Maximum chambers—4[3]
Process type—Physical Vapor Deposition (PVD)[4]
OEM—Applied Materials[2]
Wafer sizes—8, 12 inch[2]
Wafer diameter processing—150/200/300mm[3]
Chambers—4 chambers max[3]
Thickness uniformity—<2%[3]
Interfaces—SECS/GEM, GEM 300[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semi-net.comsemi-net.com
  4. [4]waferpedia.comwaferpedia.com