Comparison ledger
Applied Materials 0010 47763, Veeco RF 350, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | RF 350Veeco |
|---|---|---|
| OEM | Applied Materials | Veeco |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Veeco RF 350 |
| Specifications | ||
| Configuration | 2nd Source New[1] | Missing Parts[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Category | — | Etch[5] |
| Tool type | — | Ion Beam Etcher (IBE)[5] |
| Process modes | — | Ion Beam Etching (IBE) and Reactive Ion Beam Etching (RIBE)[5] |
| Ion source type | — | inductively coupled, filamentless RF ion source[5] |
| Ion source diameter | — | 300 mm[5] |
| Substrate loading | — | single-substrate loadlocked (or configurable to cassette-to-cassette)[5] |
| Wafer size | — | single 6" (150 mm)[5] |
| Loading | — | single 6" wafer loading[5] |
| Applications | — | MEMS, semiconductor fabrication, and data storage[5] |
| Missing parts | — | Missing parts[4] |
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