Waferpedia

Comparison ledger

0010 47763versusNE 5700

Applied Materials 0010 47763, Ulvac NE 5700, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
NE 5700Ulvac
OEMApplied MaterialsUlvac
CategoryEtchEtch
Wafer size—Wafer Equipment
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Ulvac NE-5700
Specifications
Configuration2nd Source New[1]—
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]NE 5700[5]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]Dry etching system for production[6]
Quantity available (source)1[2]—
Wafer size—Wafer Equipment[4]
Wafer Size—150mm[4]
Category—Etch[4]
Process—Metal Etcher[4]
Equipment—Dry Etcher[4]
Make—Ulvac[5]
Equipment type—Etcher[5]
Cluster Configuration—Up to two process chambers[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]dealer listingwotol.com
  5. [5]Equipment inventory listing
  6. [6]ulvac.euulvac.eu