Comparison ledger
Applied Materials 0010 47763, STS Multiplex ICP ASE Advanced Silicon Etch (ASE), side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | |
|---|---|---|
| OEM | Applied Materials | STS |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | STS Multiplex ICP |
| Cited variants | — | |
| Specifications | ||
| Configuration | 2nd Source New[3] | Currently configured for 150 mm wafers[1] |
| Type | Monopolar Dual Heated[4] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[5] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4] | — |
| Model | 0010-47763[3] | Multiplex ICP ASE[1] |
| OEM | Applied Materials[3] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[4] | — |
| Quantity available (source) | 1[4] | — |
| Voltage | — | 208V, 60Hz, 50A 3 phase[1] |
| Make | — | STS[1] |
| Wafer Sizes | — | 6 inch[1] |
| Configured wafer size | — | 150 mm wafers[1] |
| Load lock | — | Manual load lock[1] |
| Wafer handling | — | Manual load lock – Carousel Loader[6] |
| Backside cooling | — | He Backside Cooling 150mm clamp configuration[1] |
| RF power supply | — | ENI 300/30 Watt 13.56MHz RF power supply[1] |
| Upper electrode RF power supply | — | ENI ACG-10B 1KW 13.56MHz RF Upper Electrode power supply[1] |
| Turbo pump | — | Leybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller[1] |
| Gas panel | — | OnBoard gas panel – 4 MFCs[1] |
| Electrical | — | 208V, 60Hz, 50A 3 phase[1] |
| Category | — | Etch[6] |
| Process architecture | — | Inductively coupled plasma etch architecture[6] |
| Option | — | MAC Cassette to Cassette Loader can be an option[1] |
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