Comparison ledger
Applied Materials 0010 47763, Lam Research Rainbow 4520 Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Rainbow 4520 OxideLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research Rainbow 4520 Oxide |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 2nd Source New[2] | — |
| Type | Monopolar Dual Heated[3] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Model | 0010-47763[2] | Rainbow 4520[5] |
| OEM | Applied Materials[2] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[3] | — |
| Quantity available (source) | 1[3] | — |
| Wafer Size | — | 6 inch[1] |
| Vintage | — | 1996[6] |
| Wafer Size Range Minimum | — | 150 mm[7] |
| Wafer Size Range Maximum | — | 200 mm[7] |
| Set Size | — | 200 mm[7] |
| Software Revision Level | — | E1.7-024[7] |
| Power Requirements | — | 208 V, 50.0 A, 50/60 Hz[7] |
| Weight | — | 1,764 lb (800 kg)[7] |
| Exterior Dimensions | — | 47.244 in (120.0 cm) W x 98.425 in (250.0 cm) D x 66.929 in (170.0 cm) H[7] |
| Manufacturer | — | Lam Research[5] |
| Category | — | Etch[5] |
| Wafer Configuration | — | 8" (200mm) SEMI[8] |
| Features | — | Single wafer etching; wafer temperature control; variable gap spacing; parallel plate reactor; inductive RF auto tuning; simple and efficient design[9] |
| Applications | — | Contact Etch; Planarization; Via Etch; Trench Mask Etch; Pad Etch[9] |
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