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Comparison ledger

0010 47763versus2300 V 2 Exelan Flex 45 Dielectric

Applied Materials 0010 47763, Lam Research 2300 V 2 Exelan Flex 45 Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research 2300 V 2 Exelan Flex 45 Dielectric
Specifications
Configuration2nd Source New[1]—
TypeMonopolar Dual Heated[2]Dielectric Etch[4]
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]2300 V 2 Exelan Flex 45[4]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Make—Lam Research[4]
Wafer Size—12 inch[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]Equipment inventory listing