Comparison ledger
Applied Materials 0010 47763, Lam Research 2300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | 2300Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research 2300 |
| Cited variants | — | |
| Specifications | ||
| Configuration | 2nd Source New[4] | With Exelan Flex 45 Dielectric Etch Chamber[1] |
| Type | Monopolar Dual Heated[5] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[6] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[5] | — |
| Model | 0010-47763[4] | 2300[1] |
| OEM | Applied Materials[4] | Lam Research[1] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[5] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[5] | — |
| Quantity available (source) | 1[5] | — |
| 3 Chambers | — | Insulating Film, Metal, Ashing[1] |
| Wafer size | — | Wafer set up for 8"[1] |
| Wafer sizes supported | — | 8 inch, 12 inch[1] |
| Chamber configuration | — | 3 chambers: Insulating Film, Metal, Ashing[1] |
| Wafer setup | — | Wafer set up for 8 inch[1] |
| Dielectric etch chamber | — | Exelan Flex 45 Dielectric Etch Chamber[1] |
| Included subsystems | — | HDD & Software included; all pumps, generators & other subsystems included[1] |
| CE Mark | — | CE Mark 2023 Vintage[1] |
| Configuration (12-inch) | — | KIYO EXP MRT[2] |
| Category | — | Etch[1] |
| Wafer sizes | — | 8 inch, 12 inch[1] |
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