Waferpedia

Comparison ledger

0010 47763versusCentura MXP

Applied Materials 0010 47763, Applied Materials Centura MXP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Centura MXPApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Applied Materials Centura MXP
Specifications
Configuration2nd Source New[1]3 CH[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Phase—3 Phase[4]
Frequency—50 Hz[4]
Voltage—208 VAC[4]
Wires—Four[5]
Full Load Current—240 A[5]
H/E 1—0242-02163 REV D[6]
UPS—DPWR 35611[6]
H/E (CH-B_C_D_Wall)—0242-02163 REV D[6]
Chambers—3 CH[4]
Robot—HP Robot[4]
Power Supply Voltage—208 VAC[4]
Power Supply Frequency—50 Hz[4]
Number of Wires—Four / 4 Wires[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing