Comparison ledger
Applied Materials 0010 47763, Applied Materials Centura AP eMax CT+, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Centura AP eMax CT+Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials Centura AP eMax CT+ |
| Specifications | ||
| Configuration | 2nd Source New[1] | — |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | Centura AP eMax CT+[6] |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | Semiconductor manufacturing[5] |
| Quantity available (source) | 1[2] | — |
| Wafer size | — | 300 mm[4] |
| Chamber configuration | — | 3 chambers[4] |
| Vintage year | — | 2007[5] |
| Process type | — | Oxide etch[4] |
| Manufacturer | — | Applied Materials[6] |
| Tool type | — | Etcher[6] |
| Vintage | — | 01.06.2007[4] |
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