Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual Heatedversus2200 EVO Flexible Multi-Chip

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Besi 2200 EVO Flexible Multi-Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsBesi
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer Table
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedBesi 2200
Specifications
ConfigurationRefurbished[1]Tool Changer Unit 7 Slots[3]
Wafer size—Wafer Table[2]
OEM—Besi / Datacon[3]
Model—2200 EVO Flexible Multi-Chip[3]
Category—Packaging & Bonding[2]
Vacuum—Internal Vacuum Pump[2]
Tool changer—Unit 7 Slots[3]
Main unit—Musashi Super Sigma V2[3]
Axis component—P-part at Main AXIS[3]
Optics—Microscope[3]
Adapter—12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4")[3]
WP-adapter—2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT)[3]
GP-adapter—2" GP-Adapter - (12"-FF123) - 22 up - (any WT)[3]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing