Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM Siplace CA 4 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | ASM Siplace |
| Specifications | ||
| Configuration | Refurbished[1] | High Volume Chip Assembly[2] |
| Wafer size | — | 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion[2] |
| Manufacturer | — | ASM[2] |
| Model | — | Siplace CA 4 Wafer[2] |
| Category | — | Packaging & Bonding[3] |
| Assembly type | — | High Volume Chip Assembly[2] |
| Wafer systems | — | 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion[2] |
| Wafer transfer systems | — | 4 Wafer Transfer Systems[2] |
| Camera and bonding head | — | 4 LP-Kamera (TYP34) and bonding Head C+P20[2] |
| Vacuum tooling | — | Single Transport Chuck[2] |
| Cooling system | — | Chiller Cooling System[2] |
| Vacuum pump | — | X-Series[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →