Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Disco DAG 810 Ring Removal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | DAG 810 Ring RemovalDisco |
|---|---|---|
| OEM | Applied Materials | Disco |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Disco DAG 810 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | Convertible to 8"[3] |
| Supported workpiece size | — | Up to Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table)[4] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[4] |
| Grinding wheel diameter | — | Φ200 mm[4] |
| Spindle rated output | — | 4.2 kW[4] |
| Spindle rated torque | — | 5.9 N·m[4] |
| Spindle rotation speed range | — | 1,000 – 7,000 min⁻¹[4] |
| Equipment dimensions (W × D × H) | — | 600 × 1,700 × 1,780 mm[4] |
| Equipment weight | — | Approx. 1,300 kg[4] |
| Wafer size (ring removal variant) | — | 6 inch (convertible to 8 inch)[3] |