Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Applied Materials Centura 5200 MXP+, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | Centura 5200 MXP+Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Applied Materials Centura 5200 |
| Cited variants | — |
|
| Specifications | ||
| OEM | Applied Materials[2] | — |
| Model | 0010-16392[2] | Centura 5200 MXP+[4] |
| Type | ESC Assembly[2] | — |
| Wafer Size | 300 mm[3] | — |
| Electrode Configuration | Dual[3] | — |
| Configuration | — | Components:[4] |
| ESC Type | — | Polymide[4] |
| Endpoint | — | Monochromator[4] |
| Gases Used | — | NF3, CH3F, CL2, HBr, CHF3, Ar, CF4, O2, N2, C4F8, CO[4] |
| Mass Flow Controllers (MFCs) | — | 32 Digital MFCs (14-Unit or 18-Horiba)[4] |
| Software Version | — | 4.9_15[4] |
| Dry Pumps | — | IQDP80 (x4) / IQDP80/WSU151 (x2)[5] |
| Chillers | — | Neslab 150 units (x5)[4] |
| Mainframe | — | SHO[6] |
| Gas Panel Type | — | Standard[6] |
| Voltage | — | 208 VAC, 3 Phase, 240 A, 50/60 Hz[6] |
| System Controller | — | Standard[6] |
| Fab Installation | — | TTW[6] |
| System Umbilicals | — | 50 ft - standard[6] |
| Heat Exchanger Type 1 | — | AMAT 0[6] |
| Heat Exchanger Type 2 | — | Neslab[6] |
| Loadlock pump | — | Ebara[6] |
| Pump Size | — | A 10[6] |
| I/O Slit Valve Type | — | Viton[6] |
| HF RF Gen Type | — | ENI OEM 12B-3[6] |
| Etch RF Match Type | — | Phase 4[7] |
| FAB Monitor | — | TTW[6] |
| Liquid Delivery | — | None[6] |
| LF RF Gen Type | — | None[6] |
| Chamber A | — | MXP[6] |
| Slit Valve Type | — | Anodized[6] |
| Chamber A Process | — | Oxide[6] |
| Process Kit Type | — | Oxide Etch ESC[6] |
| Manufacturer | — | Applied Materials[4] |
| Category | — | Etch[7] |
| Wafer size | — | 200 mm[5] |
| Configured for | — | 200 mm[5] |
| HF RF generator type | — | ENI OEM 12B-3[7] |
| LF RF generator type | — | None[7] |
| Vacuum pumps | — | IQDP80 (x4) / IQDP80/WSU151 (x2)[4] |
| Robot | — | HP Robot[4] |
| Gas delivery | — | 32 Digital MFCs (14-Unit or 18-Horiba)[7] |
| Control software | — | 4.9_15[5] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →