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0010-13622 RF Match forversusBTT IV Thermal

Applied Materials 0010-13622 RF Match for, Denton Vacuum BTT IV Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
BTT IV ThermalDenton Vacuum
OEMApplied MaterialsDenton Vacuum
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forDenton Vacuum BTT IV Thermal
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]Benchtop[3]
Model0010-13622[1]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Voltage—208 V, Single Phase, 50/60 Hz, 20 A[2]
Power—208 V, Single Phase, 50/60 Hz, 20 A[2]
Vacuum—Turbo High Vacuum[2]
Controller—Touch Screen PLC Controller[2]
Thermal source configuration—Currently configured with one thermal evaporative source[2]
Thickness monitor—Crystal film thickness monitor option installed[2]
Bell jar—Quartz bell jar with implosion guard, 12" diameter x 18" high[2]
Ultimate vacuum—5*10-6 torr[4]
Vacuum system—70 l/sec turbomolecular pump, oil mechanical pump[4]
System features—Integrated touch screen control panel; automatic pumpdown and venting with manual overrides; automatic control of filament evaporation cycle; high vacuum valve; LN 2 cold trap clean[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]eicn.cnsi.ucla.edueicn.cnsi.ucla.edu