Waferpedia

Comparison ledger

0010-03485 Magnet AssyversusACS 200 Spin

Applied Materials 0010-03485 Magnet Assy, SUSS MicroTec ACS 200 Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03485 Magnet AssyApplied Materials
ACS 200 SpinSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-03485 Magnet AssySUSS MicroTec ACS 200 Spin
Cited variants—
Specifications
ConfigurationWP AL 300mm PVD[2]—
OEMApplied Materials[2]—
Model0010-03485[2]—
DescriptionMAGNET ASSY, WP AL 300MM PVD[3]—
ProcessPVD[4]—
Wafer size300mm[5]—
VersionSpares[5]—
Part Number0010-03485[2]—
ManufacturerApplied Materials[2]—
Process TypePVD (Physical Vapor Deposition)[2]—
Application (Material)Aluminum (AL)[2]—
Wafer Diameter (associated)300 mm[2]—
Maximum wafer diameter—200 mm (8 in)[6]
Maximum substrate thickness—5 mm[6]
Wafer diameters supported—50 mm, 75 mm, 100 mm, 150 mm, 200 mm[6]
Photomask sizes supported—125 mm x 125 mm, 150 mm x 150 mm[6]
Coating modules—Gyrset spin coat; Alta spray coat[6]
Hotplate maximum temperature—250 °C[6]
Edge-bead removal—Automated with backside rinse[6]
Small pieces supported—Yes[6]
Sources (6)Every fact above is drawn from these public sources
  1. [1]doi.orgdoi.org
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]layla-ec.comlayla-ec.com
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]nist.govnist.gov