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Comparison ledger

MDX-10Kversus0010-03485 Magnet Assy

Advanced Energy MDX-10K, Applied Materials 0010-03485 Magnet Assy, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MDX-10KAdvanced Energy
0010-03485 Magnet AssyApplied Materials
OEMAdvanced EnergyApplied Materials
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAdvanced Energy MDX-10KApplied Materials 0010-03485 Magnet Assy
Cited variants—
Specifications
Part Number3152313-000AB[1]0010-03485[5]
Model Number2012-043-R[2]—
ManufacturerAdvanced Energy[1]Applied Materials[5]
ModelMDX-10K[1]0010-03485[5]
DescriptionRF GENERATOR[1]MAGNET ASSY, WP AL 300MM PVD[6]
VersionSpares[1]Spares[8]
Quantity1[1]—
Sales Conditionas is where is[1]—
Power10 kW[4]—
TypeDC magnetron power supply[4]—
Applicationsthin film deposition and sputtering[4]—
Output Power10 kW[4]—
Regulation ModesPower, Current, Voltage[4]—
Regulation Accuracy0.25% in all modes[4]—
Ripple1% RMS at 100 kHz[4]—
Ignition Voltage1550 V[4]—
Response Time5 µs to plasma load changes[4]—
Ramp Timer0 to 99.0 minutes, programmable[4]—
Run TimerContinuous or 0 to 99.0 minutes, programmable[4]—
Voltage Configuration Standard Z Taps500–600 V, 600–800 V, 800–1000 V[4]—
Voltage Configuration Low Z Taps400–500 V, 500–640 V, 640–800 V[4]—
Voltage Configuration High Z Taps600–775 V, 775–1000 V, 1000–1250 V[4]—
Input Voltage208 V ± 10%, 380 V ± 10%, 415 V ± 10% (3-phase, 50/60 Hz)[4]—
Input Current34 A[4]—
Weight71 lb[4]—
CoolingForced-air[4]—
Standard Z Taps500–600 V, 600–800 V, 800–1000 V[4]—
Low Z Taps400–500 V, 500–640 V, 640–800 V[4]—
High Z Taps600–775 V, 775–1000 V, 1000–1250 V[4]—
Height25 inches[4]—
Operating Temperature0 to 45°C ambient[4]—
Humidity92% relative humidity, non-condensing[4]—
Control InterfacesFront panel, user port (RS-232), analog remote control[4]—
Analog Control Signals0–5 V for voltage, current, and power control[4]—
Interlock InputsVacuum, water, system[4]—
Configuration—WP AL 300mm PVD[5]
OEM—Applied Materials[5]
Process—PVD[7]
Wafer size—300mm[8]
Process Type—PVD (Physical Vapor Deposition)[5]
Application (Material)—Aluminum (AL)[5]
Wafer Diameter (associated)—300 mm[5]
Sources (8)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]aumictechlabs.comaumictechlabs.com
  5. [5]inventory listing
  6. [6]semistarcorp.comsemistarcorp.com
  7. [7]layla-ec.comlayla-ec.com
  8. [8]fabsurplus.comfabsurplus.com