Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Mattson Aspen III, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Aspen IIIMattson | |
|---|---|---|
| OEM | ABM | Mattson |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Mattson Aspen |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[3] | — |
| Description | ROBOT[3] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[3] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[3] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[3] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[3] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[3] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[3] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[3] | — |
| Configuration | — | Low K[4] |
| Wafer size | — | 8 inch[4] |
| Wafer sizes (Highlands) | — | 200 / 300 mm[1] |
| Wafer sizes (CVD) | — | 200 / 300 mm bridge tool[2] |
| Process technology (Highlands) | — | Proprietary ICP technology[1] |
| Processing capability (Highlands) | — | Dual-wafer processing[1] |
| Design (Highlands) | — | Modular design allowing process modules to be added[1] |
| Throughput (CVD) | — | Up to 180 wafers per hour[2] |
| Deposited films (CVD) | — | Silane-based films (oxide, oxynitride, nitride) and TEOS-based oxide films[2] |
| Bridge capability (CVD) | — | Same process chamber can process either 200mm or 300mm wafers[2] |