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Comparison ledger

-407B-1-S-CES293 RobotversusB2

ABM -407B-1-S-CES293 Robot, YES B2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
B2YES
OEMABMYES
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Manual revision date
Control system——
Generation——
FamilyABM -407B-1-S-CES293 RobotYES B2
Cited variants—
Specifications
ModelABM-407B-1-S-CES293[2]—
DescriptionROBOT[2]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2]—
Control computer—80486-based PC[1]
Operating system—MS-DOS with Windows[1]
Process types—RIE, PE, PECVD, ICP, and ECR[1]
Primary Module vacuum connection—100 mm, 160 mm (ICP), or 250 mm (ECR) diameter at the pump connection flange[1]
Process gas channels—Up to sixteen process gas channels under mass flow control, up to eight per chamber[1]
Endpoint detection—Emission spectroscopy and laser-based systems[1]
RF generator—500 Watt solid-state 13.56 MHz generator; ICP systems also include an additional 1000 Watt limited solid-state 2 MHz RF generator[1]
Sources (2)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]dealer listingsemistarcorp.com