Comparison ledger
ABM -407B-1-S-CES293 Robot, CHA 600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 600CHA | |
|---|---|---|
| OEM | ABM | CHA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | CHA 600 |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| System type | — | High vacuum deposition system[2] |
| Baseplate | — | Typically 20 inches; accommodates up to 15 feedthroughs for instrumentation, control and rotary motion[2] |
| Bell jar | — | Most often 19.5" diameter bell jar[2] |
| Fixture capacity | — | Planetary Fixturing having a capacity of 18 4" wafers[2] |
| Pumpdown time | — | Average pumpdown time of less than 30 minutes[2] |
| Throughput | — | In excess of 54 wafers per hour[2] |
| Ultimate vacuum | — | 10^-8 torr range[2] |
| Cryogenic pump | — | 8"[2] |
| Mechanical pump | — | 23-57 CFM, dual stage[2] |
| Cold trap | — | 2.5 liter capacity, 200 sq. inches of surface area, 10 hours holding time[2] |
| Water baffle | — | Optically dense, chevron baffle[2] |
| High vacuum valve | — | 7-3/4" I.D., seals vertically[2] |
| Foreline/Roughing valves | — | 3" I.D.[2] |
| Valve actuation | — | Electro-pneumatic (all vacuum valves)[2] |
| Valve sequencing | — | Manual and automatic (Auto-Tech II)[2] |
| Ionization gauge control | — | Dual ionization gauge tube, auto ranging with dual convectron positions[2] |
| Dimensions | — | 79"H x 43"W x 37"D[2] |
| Weight | — | 1,200 pounds[2] |
| Electrical utility | — | 208/10/70A/4-wire connection with ground (3 phase, 5-wire also available)[2] |
| Water utility | — | 10 GPM (minimum)[2] |
| Air utility | — | 90-110 PSIG[2] |
| Optional diffusion pump | — | 2400 liter/second, 6" normal[2] |
| Process chamber option | — | 19.5" diameter x 30" H, ambient or water-cooled (larger bell jars available)[2] |
| Baseplate options | — | 20" or 26" diameter, 7-3/4" pumping port[2] |
| Substrate heat | — | 2-10 kW[2] |
| Deposition sources | — | Any commercially available source, including single and multiple beam, CHA's resistance and sputtering sources[2] |
| Deposition capability (SEC-600) | — | E-Beam Evaporator available for users to evaporate their own metal sources[3] |
| Approved deposition materials (SEC-600) | — | Al, Au, Ag, Cu, Cr, Ge, Ni, Mo, Pd, Pt, Ti and others on case-by-case basis[3] |
| Substrate size capacity (SEC-600) | — | Small samples through 100 mm wafers[3] |